[1]吴申庆,邵力为,刘洁美,等.用俄歇电子谱法研究锡铅焊料的抗氧化机理[J].东南大学学报(自然科学版),1989,19(4):74-79.[doi:10.3969/j.issn.1001-0505.1989.04.011]
 Wu Shenqing Shao Liwei~* Liu Jiemei~* Jiang Wenbiao(Department of Material Science & Engineering).Mechanism of the Antioxidation of Sn-Pb Solder Analyzed with Auger Electron Spectrometry[J].Journal of Southeast University (Natural Science Edition),1989,19(4):74-79.[doi:10.3969/j.issn.1001-0505.1989.04.011]
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用俄歇电子谱法研究锡铅焊料的抗氧化机理()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
19
期数:
1989年第4期
页码:
74-79
栏目:
本刊信息
出版日期:
1989-07-20

文章信息/Info

Title:
Mechanism of the Antioxidation of Sn-Pb Solder Analyzed with Auger Electron Spectrometry
作者:
吴申庆邵力为刘洁美姜文标
东南大学材料科学与工程系; 东南大学电子研究所; 东南大学材料科学与工程系
Author(s):
Wu Shenqing Shao Liwei~* Liu Jiemei~* Jiang Wenbiao(Department of Material Science & Engineering)
关键词:
软钎料 抗氧化剂 俄歇电子谱法
Keywords:
tin lead solder antioxidation Auger electron S spectrometers
分类号:
+
DOI:
10.3969/j.issn.1001-0505.1989.04.011
摘要:
用AES-350型俄歇电子能谱仪对普通锡铅焊料和抗氧化焊料自液态冷却的自由表面进行分析研究,证明普通焊料表面因Sn的富集,易于形成不断增厚的氧化层;而微量元素Ga在抗氧化焊料表面富集倾向远大于Sn,并形成不到10nm的富Ga表面保护膜。本文指出,在保护膜内高价Ga离子使表面层离子排列空位增加并使比电导降低,是产生抗氧化性的原因。
Abstract:
The free surface of cooled common Sn-Pb solder and antioxidable solder contained with trace Ga element were investigated by AES-350 Auger electron spectroscopy. The results show that on the surface of common solder the oxidized layer is continuously formed and grew as a result of enriching of Sn element, but on the surface of antioxidable solder, the enrichment of Ga is far stronger than that of Sn, and a protective film, which is less than 10 nm, is formed. The authors consider that in the protective film the ion vacancy increases and the specific electric conductivity of film reduces by the exist of Ga ion, which is the reason of yielding oxidation resistance.

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更新日期/Last Update: 2013-04-30