[1]何晓磊,苏岩.采用DDSOG工艺加工Z轴微机械陀螺仪实验[J].东南大学学报(自然科学版),2005,35(4):545-548.[doi:10.3969/j.issn.1001-0505.2005.04.011]
 He Xiaolei,Su Yan.Fabrication of Z-axis micromachined gyroscope with DDSOG process[J].Journal of Southeast University (Natural Science Edition),2005,35(4):545-548.[doi:10.3969/j.issn.1001-0505.2005.04.011]
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采用DDSOG工艺加工Z轴微机械陀螺仪实验()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
35
期数:
2005年第4期
页码:
545-548
栏目:
仪器科学与技术
出版日期:
2005-07-20

文章信息/Info

Title:
Fabrication of Z-axis micromachined gyroscope with DDSOG process
作者:
何晓磊 苏岩
东南大学仪器科学与工程系, 南京 210096
Author(s):
He Xiaolei Su Yan
Department of Instrument Science and Technology, Southeast University, Nanjing 210096, China
关键词:
体硅薄片融解工艺 DDSOG 灵敏度 微机械陀螺仪
Keywords:
bulk silicon dissolved wafer process DDSOG sensitivity micromachined gyroscope
分类号:
U666.12
DOI:
10.3969/j.issn.1001-0505.2005.04.011
摘要:
从理论上分析了Z轴微机械陀螺仪结构的工作机理,比较了体硅薄片融解工艺和DDSOG工艺的优缺点.介绍了采用DDSOG工艺加工的Z轴微机械振动陀螺的特点,并与采用体硅薄片融解工艺加工的相同Z轴微机械振动陀螺进行了残余应力、品质因数及灵敏度等性能参数的比较,采用DDSOG工艺后陀螺的驱动品质因数是原来体硅薄片融解工艺的1.45倍,而检测品质因数是原来的0.11倍.最后,比较了采用2种不同工艺加工后Z轴微机械陀螺的实验结果,结果表明采用DDSOG工艺加工后陀螺的灵敏度比原来采用体硅薄片融解工艺加工的陀螺的灵敏度提高了近10倍.
Abstract:
A Z-axis micromachined gyroscope is proposed. Its operating principle is analyzed in theory. The advantage and disadvantage between bulk silicon dissolved wafer process and DDSOG(deeply dissolved silicon on glass)process are compared. The characteristic of Z-axis micromachined gyroscope from DDSOG process is introduced.The Z-axis micromachined gyroscopes from DDSOG process and bulk silicon dissolved wafer process are compared in residual stress, quality factor and sensitivity. By calculation, the drive quality factor of the gyroscope from DDOSG process is 1.45 times of that from bulk silicon dissolved wafer process, but the sense quality factor of the former is only 0.11 times of the latter. Finally the experiment results of both kinds of gyroscope are compared and it is indicated that the sensitivity of the gyroscope from DDSOG process is about ten times greater than that from bulk silicon dissolved wafer process.

参考文献/References:

[1] 王寿荣.硅微型惯性器件理论及应用[M].南京:东南大学出版社,2000.1-5.
[2] 姚雅红,吕苗,赵永军.采用薄片溶解工艺制造微机械惯性仪表的实验研究[J].清华大学学报,1998,38(11):12-15.
  Yao Yahong,Lu Miao,Zhao Yongjun.Study on fabrication of micromechanical inertial instruments with bulk silicon dissolved wafer [J].Journal of Tsinghua University,1998,38(11):12-15.(in Chinese)
[3] Freed M,Kruger M V P,Poolla K,et al.Wafer-grown heat flux sensor arrays for plasma etch processes[J]. IEEE Transactions on Semiconductor Manufacturing,2005,18(1):148-162.
[4] Hao Y L,Zhang D C.Silicon-based MEMS process and standardization[J]. Solid-State and Integrated Circuits Technology,2004,3(18-21):1835-1838.
[5] 姚雅红,赵永军,吕苗.采用CCL2F2/O2的高深宽比硅槽的刻蚀[J].1998,19(7):542-547.
  Yao Yahong,Zhao Yongjun,Lü Miao.High aspect ratio trench etching of Si using CCL2F2/O2gas mixture[J].1998,19(7):542-547.(in Chinese)
[6] 郝一龙,张立宪,李婷,等.硅基MEMS技术[J].机械强度,2001,23(4):523-526.
  Hao Yilong,Zhang Lixian,Li Ting,et al.Technology of silicon-based MEMS[J]. Journal of Mechanical Strength,2001,23(4):523-526.(in Chinese)
[7] Lee K B,Lin L.Surface micromachined glass and polysilicon microchannels using MUMPs for bioMEMS applications[J].Sensors and Actuators A,2004,111:44-50.
[8] Gao D,Wijesundara M B J,Carraro C,et al.Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology[J]. IEEE Sensors Journal,2004,4(4):441-448.
[9] 裘安萍.硅微机械振动陀螺仪结构设计技术研究[D].南京:东南大学仪器科学与工程系,2001.

备注/Memo

备注/Memo:
作者简介: 何晓磊(1982—),男,硕士生; 苏岩(联系人),男,博士,副教授, suyan@seu.edu.cn.
更新日期/Last Update: 2005-07-20