[1]史金飞,戴敏.基于MVA的半导体生产过程质量分析方法[J].东南大学学报(自然科学版),2006,36(3):351-355.[doi:10.3969/j.issn.1001-0505.2006.03.003]
 Shi Jinfei,Dai Min.Process quality analysis in semiconductor manufacturing based on multi-vari analysis[J].Journal of Southeast University (Natural Science Edition),2006,36(3):351-355.[doi:10.3969/j.issn.1001-0505.2006.03.003]
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基于MVA的半导体生产过程质量分析方法()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
36
期数:
2006年第3期
页码:
351-355
栏目:
经济与管理
出版日期:
2006-05-20

文章信息/Info

Title:
Process quality analysis in semiconductor manufacturing based on multi-vari analysis
作者:
史金飞 戴敏
东南大学机械工程学院, 南京 210096
Author(s):
Shi Jinfei Dai Min
College of Mechanical Engineering, Southeast University, Nanjing 210096, China
关键词:
多变异分析 方差分析 过程能力指数
Keywords:
multi-vari analysis analysis of variance process capability index
分类号:
F224
DOI:
10.3969/j.issn.1001-0505.2006.03.003
摘要:
针对半导体晶圆生产中存在着位置间变异、晶圆间变异及批次间变异,提出了基于多变异分析(MVA)的工序质量分析方法.该方法通过建立基于方差分析晶圆生产工序质量的多变异分析模型,研究了晶圆生产过程中3种变异与总变异之间的定量关系.由定量关系推导出晶圆生产中的抽样规则,并提出了3种常用过程能力指数Cp,Cpkpk和Cpm的改进计算方法.通过在晶圆生产中的实际应用,证明了该方法中的抽样规则能捕获加工过程中主要随机变异,该方法计算获得的过程能力指数可较为真实地反映生产过程质量状况.
Abstract:
The process quality of semiconductor manufacturing is influenced by variant factors, such as positional variation, cyclical variation and temporal variation. A new process quality analysis method based on multi-vari analysis is presented. In this method, a model based on multi-vari analysis is set up to analyze the relationship between the total variation and the three kinds of variation. How to make a reliable sampling plan is discussed. And the improved expression of process capability index base on multi-vari relationship is addressed. The process quality analysis method has been tested in a semiconductor manufacturing process. The result shows that the sampling plan can capture the main random variation effectively, and the process quality can be described precisely by the improved process capability indices.

参考文献/References:

[1] 何桢,李国春,石金桥.工序质量分析与控制中的多变异分析方法[J].系统工程理论与实践,2000,20(5):42-45.
  He Zhen,Li Guochun,Shi Jinqiao.Multi-vari analysis in process quality analysis and control[J].Systems Engineering—Theory & Practice,2000,20(5):42-45.(in Chinese)
[2] Bobbitt C E Jr.Understanding manufacturing process variation with multi-vari analysis[C] //Advances Semiconductor Manufacturing Conference and Workshop.Danvers,MA,USA,1990:137-141.
[3] 易新颜,田澎.基于过程能力指数的抽样方案研究[J].技术经济与管理研究,2004(4):55-56.
[4] Chen Argon,Guo Ruey-Shan,Yeh Pei-Chen.An effective SPC approach to monitoring semiconductor quality data with multiple variation sources[C] //IEEE Conference Proceeding on Semiconductor Manufacturing Technology Workshop.Boston,2000:279-282.
[5] Juran J M.Juran’s quality control handbook[M].3rd ed.New York:McGraw-Hill,1974:117-128.
[6] Kotz S,Johnson N L.Process capability indices—a review,1999-2000[J].Journal of Quality Technology,2002,34(1):2-19.
[7] Kane V E.Process capability indices[J].Journal of Quality Technology,1986,18(1):41-52.
[8] Hsiang T C,Taguchi G.Tutorial on quality control and assurance-the Taguchi methods[C] //Joint Meetings of the American Statistical Association.Las Vegas:Nevada,1985:188.
[9] Chan Lai-Kow,Cheng S W,Spiring F A.A new measure of process capability:Cpm[J].Journal of Quality Technology,1988,20(2):162-175.

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备注/Memo

备注/Memo:
基金项目: 国家自然科学基金资助项目(70272046).
作者简介: 史金飞(1964—),男,博士,教授,博士生导师,shijf@seu.edu.cn.
更新日期/Last Update: 2006-05-20