[1]薛烽,周健,李培培,等.界面反应及界面张力对Sn-Zn-Bi焊料润湿性的影响[J].东南大学学报(自然科学版),2007,37(4):634-638.[doi:10.3969/j.issn.1001-0505.2007.04.018]
 Xue Feng,Zhou Jian,Li Peipei,et al.Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders[J].Journal of Southeast University (Natural Science Edition),2007,37(4):634-638.[doi:10.3969/j.issn.1001-0505.2007.04.018]
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界面反应及界面张力对Sn-Zn-Bi焊料润湿性的影响()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
37
期数:
2007年第4期
页码:
634-638
栏目:
电子科学与工程
出版日期:
2007-07-20

文章信息/Info

Title:
Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders
作者:
薛烽 周健 李培培 方伊莉
东南大学材料科学与工程学院, 南京 211189
Author(s):
Xue Feng Zhou Jian Li Peipei Fang Yili
School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
关键词:
无铅焊料 润湿性 界面张力 扩散
Keywords:
lead-free solder wettability interface tension diffusion
分类号:
TN604
DOI:
10.3969/j.issn.1001-0505.2007.04.018
摘要:
通过合金化的方式得到了Sn-Zn-Bi三元及Sn-Zn-Bi-Nd四元无铅焊料,采用润湿平衡法测量了其润湿力和润湿时间,并对润湿后的焊料/Cu界面组织进行了分析.结果表明:Bi元素不参与焊料/Cu界面的扩散反应,但能够通过吸附作用降低界面张力,从而提高焊料在Cu基底上的润湿力; Zn元素优先向焊料/Cu界面进行扩散形成Cu5Zn8金属间化合物,且扩散层随焊料中Zn含量的提高而增长,此时固-液界面张力方向发生改变,润湿力提高,但润湿时间延长; Nd元素的作用类似于Bi,既能提高焊料的润湿力,也能够缩短润湿时间,是一种改善Sn-Zn基焊料润湿性的有效元素.
Abstract:
Wetting balance method was used to measure the wetting force and wetting time of Sn-Zn-Bi ternary solders and Sn-Zn-Bi-Nd quaternary solders on Cu substrate and the microstructure of solder/Cu joint after reactive wetting was investigated. The results show that Bi rarely diffuses into Cu substrate, but it is inclined to be adsorbed in Sn-Zn-Bi solder/Cu interface, which results in decrease of solder/Cu interface tension. Zn individually reacts with Cu in the progress of wetting and forms intermetallic compound Cu5Zn8. With addition of Zn into the Sn-Zn-Bi solders, orientation of solid-liquid interface tension changes with the increase of thickness of reactive layer. As a result, the wetting force increases, but wetting time obviously extends. Like the role of Bi, addition of Nd into Sn-Zn-Bi solders can enhance wetting force and shorten wetting time, therefore effectively improves wettability of the solders.

参考文献/References:

[1] Mulugeta A,Guna S.Lead-free solders in microelectronics [J].Materials Science and Engineering R,2000,27(5/6):95-141.
[2] Katsuki S.Advances in lead-free electronics soldering [J]. Current Opinion in Solid State and Materials Science,2001,5(1):55-64.
[3] Chen Xi,Li Ming,Ren Xiaoxue,et al.Effect of alloying elements on the characteristics of Sn-Zn lead free solder[C] //Proceeding of 6th International Conference on Electronics Packaging Technology.Shenzhen,China,2005:211-217.
[4] Lin K-L,Chen K-I,Hsu H-M,et al.Improvement in the properties of Sn-Zn eutectic based Pb-free solder[C] //Proceedings of 53rd Electronic Components and Technology Conference.New Orleans,Louisiana,2003:658-663.
[5] Villain J,Jillek W,Schmitt E,et al.Properties and reliability of SnZn-based lead-free solder alloys[C] //Proceedings of 2004 International IEEE Conference on the Asian Green Electronics.Hong Kong,China,2004:38-41.
[6] Kim Young-Sun,Kim Keun-Soo,Hwang Chi-Won,et al.Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys[J]. Journal of Alloys and Compounds,2003,352(1/2):237-245.
[7] Zhou J,Sun Y S,Xue F.Properties of low melting point Sn-Zn-Bi solders [J]. Journal of Alloys and Compounds,2005,397(1/2):260-264.
[8] Prasad L C,Mikula A.Surface segregation and surface tension in Al-Sn-Zn liquid alloys [J]. Physica B:Condensed Matter,2006,373(1):142-149.
[9] Lin K-L,Wen L-H.Wetting of copper by Al-Zn-Sn solders [J]. Journal of Materials Science:Materials in Electronics,1998,9(1):5-8.
[10] Pavel P,Anne T,Vladimir T,et al.The role of intermetallics in wetting in metallic systems [J].Scripta Materialia,2001,45(12):1439-1445.
[11] Yost F G.Kinetic of reactive wetting [J].Scripta Materialia,2000,42(8):801-806.
[12] Warren J A,Boettinger W J,Roosen A R.Modeling reactive wetting[J].Acta Materialia,1998,46(9):3247-3264.
[13] Zhou J,Sun Y S,Xue F.Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders [J]. Transactions of Nonferrous Metals Society of China,2005,15(5):1161-1165.
[14] 胡福增,陈国荣,杜永娟.材料表界面[M].上海:华东理工大学出版社,2001.
[15] 朱履冰,包兴.表面与界面物理[M].天津:天津大学出版社,1992.

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备注/Memo

备注/Memo:
作者简介: 薛烽(1970—),男,博士,教授,xuefeng@seu.edu.cn.
更新日期/Last Update: 2007-07-20