[1]王常亮,周健,孙扬善,等.Sn-8Zn-3Bi无铅钎料的抗氧化性[J].东南大学学报(自然科学版),2008,38(4):693-697.[doi:10.3969/j.issn.1001-0505.2008.04.029]
 Wang Changliang,Zhou Jian,Sun Yangshan,et al.Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys[J].Journal of Southeast University (Natural Science Edition),2008,38(4):693-697.[doi:10.3969/j.issn.1001-0505.2008.04.029]
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Sn-8Zn-3Bi无铅钎料的抗氧化性()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
38
期数:
2008年第4期
页码:
693-697
栏目:
电子科学与工程
出版日期:
2008-07-20

文章信息/Info

Title:
Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys
作者:
王常亮 周健 孙扬善 方伊莉
东南大学材料科学与工程学院, 南京 211189; 江苏省先进金属材料高技术研究重点实验室, 南京 211189
Author(s):
Wang Changliang Zhou Jian Sun Yangshan Fang Yili
School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
Jiangsu Key Laboratory for Advanced Metallic Materials, Nanjing 211189, China
关键词:
无铅钎料 Sn-8Zn-3Bi Al P 抗氧化性
Keywords:
lead-free solder Sn-8Zn-3Bi Al P oxidation resistance
分类号:
TN604
DOI:
10.3969/j.issn.1001-0505.2008.04.029
摘要:
为了提高Sn-8Zn-3Bi合金钎料的抗氧化性,在Sn-8Zn-3Bi合金基础上,通过加入少量的其他合金元素(Al,P)以提高钎料的抗氧化性.少量Al的加入降低了Sn-8Zn-3Bi钎料的氧化量,而加入P的Sn-8Zn-3Bi钎料在加热过程中不仅没有质量增加,反而出现减重现象.通过扫描电镜和X射线衍射等分析手段研究样品的表面微观结构和显微组织,探讨了Al,P的抗氧化机理.分析结果表明:Al通过在合金表面形成一层致密的氧化膜,阻止钎料直接接触周围空气,从而达到了降低氧化速率的目的; P通过自身不断被氧化而消耗钎料表面的O原子,从而保护元素Sn和Zn不被氧化.
Abstract:
Some trace elements(Al and P)are added into Sn-8Zn-3Bi solder in order to improve its oxidation resistance. The result shows that Al reduces the weight gains of alloys significantly while P causes weight losses of alloys. Oxidation surface of the alloys were examined by micro-analysis including scanning electronic microscope(SEM)and X-ray diffraction(XRD), to ascertain how the trace elements(Al and P)improve the Sn-8Zn-3Bi solder’s oxidation resistance. The result shows that Al can form a layer of dense oxide to prevent further oxidation while P is oxidized continuously to absorb atoms of oxygen so that it can prevent Sn and Zn from being oxidized.

参考文献/References:

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相似文献/References:

[1]周健,王常亮,薛烽.Sn-Zn钎料Cu接头的界面反应及力学性能[J].东南大学学报(自然科学版),2009,39(3):615.[doi:10.3969/j.issn.1001-0505.2009.03.037]
 Zhou Jian,Wang Changliang,Xue Feng.Interfacial reaction and joint strength of Sn-Zn solder/Cu[J].Journal of Southeast University (Natural Science Edition),2009,39(4):615.[doi:10.3969/j.issn.1001-0505.2009.03.037]
[2]付小琴,周健,孙扬善,等.Sn-8Zn-3Bi-P无铅钎料微观组织及性能[J].东南大学学报(自然科学版),2006,36(5):831.[doi:10.3969/j.issn.1001-0505.2006.05.030]
 Fu Xiaoqin,Zhou Jian,Sun Yangshan,et al.Effect of phosphorus on microstructure and properties of Sn-8Zn-3Bi lead-free solder[J].Journal of Southeast University (Natural Science Edition),2006,36(4):831.[doi:10.3969/j.issn.1001-0505.2006.05.030]

备注/Memo

备注/Memo:
作者简介: 王常亮(1985—),男,硕士生; 周健(联系人),男,博士,讲师,jethro@seu.edu.cn.
引文格式: 王常亮,周健,孙扬善,等.Sn-8Zn-3Bi无铅钎料的抗氧化性[J].东南大学学报:自然科学版,2008,38(4):693-697.
更新日期/Last Update: 2008-07-20