[1]张秀群,孙扬善,薛烽,等.Ni,Si,Mn和Ti对高强度铜合金力学性能和导电性能的影响[J].东南大学学报(自然科学版),2003,33(4):458-462.[doi:10.3969/j.issn.1001-0505.2003.04.019]
 Zhang Xiuqun,Sun Yangshan,Xue Feng,et al.Effect of Ni, Mn, Si and Ti on mechanical and electronic properties of copper alloy[J].Journal of Southeast University (Natural Science Edition),2003,33(4):458-462.[doi:10.3969/j.issn.1001-0505.2003.04.019]
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Ni,Si,Mn和Ti对高强度铜合金力学性能和导电性能的影响()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
33
期数:
2003年第4期
页码:
458-462
栏目:
材料科学与工程
出版日期:
2003-07-20

文章信息/Info

Title:
Effect of Ni, Mn, Si and Ti on mechanical and electronic properties of copper alloy
作者:
张秀群 孙扬善 薛烽 闵学刚 杜飞
东南大学材料科学与工程系,南京 210096
Author(s):
Zhang Xiuqun Sun Yangshan Xue Feng Min Xuegang Du Fei
Department of Materials Science and Engineering, Southeast University, Nanjing 210096, China
关键词:
力学性能 电导率 铜合金 显微组织
Keywords:
mechanical properties electrical conductivity copper alloy microstructure
分类号:
TG132.2
DOI:
10.3969/j.issn.1001-0505.2003.04.019
摘要:
利用合金化方法,并借助金相、SEM等测试分析手段研究了Ni/Si,Mn/NiSi和Ti对纯铜显微组织、力学性能和导电性能的影响.结果表明,Ti,Ni和Si均有提高合金组织稳定性的作用,但Mn,Ni和Si的加入不能有效地阻碍合金组织在高温下的长大.Ti,Ni和Si的加入还大幅度提高了合金强度. 含w(Ni)=6%和w(Si)=1.42%的铜合金的抗拉强度达到了907 MPa,同时,合金的导电性也保持在较高水平,达到了强度和导电性的良好匹配.然而Mn,Ni和Si的加入没有明显的强化作用,反而使导电性大幅降低.
Abstract:
Microstructure, mechanical properties and electrical conductivity of copper based alloys with additions of Ni/Si, Mn/NiSi, and Ti have been investigated by optical microscope and scanning electron microscope. It is found that the microstructure stability of the alloys increases when Ti, Ni and Si is added, while the addition of Mn,Ni and Si can not restrict the growth of the matrix grains at elevated temperatures. The strength of alloy increases remarkably with Ti, Ni and Si additions and it reaches 907 MPa when 6%Ni and 1.42%Si are added. The electrical conductivity of the alloy deceases with the Ni/Si addition but it still remains at a high level. Additions of Mn,Ni and Si do not result in increase of strength, meanwhile the electrical conductivity decreases significantly.

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备注/Memo

备注/Memo:
作者简介: 张秀群(1980—),女,硕士生; 孙扬善(联系人),男,教授,博士生导师,yssun@seu.edu.cn.
更新日期/Last Update: 2003-07-20