参考文献/References:
[1] 任晓雪,李明,毛大立.合金元素对 Sn-Zn 基无铅钎料高温抗氧化性的影响[J].电子元件与材料,2004,23(11):39-44.
Ren Xiaoxue,Li Ming,Mao Dali.Effect of alloying elements on the high-temperature oxidation resistance of Sn-Zn based lead-free solder [J]. Electronic Components & Materials,2004,23(11):39-44.(in Chinese)
[2] Lin Kwanglung,Liu Tzyping.High-temperature oxidation of a Sn-Zn-Al solder [J].Oxidation Metals,1998,50(3,4):255-267.
[3] Iwasaki Tomohiro.Encapsulation of lead-free Sn/Zn/Bi solder alloy particles by coating with wax powder for improving oxidation resistance [J]. Journal of Electronic Materials,2005,34(5):647-654.
[4] Andersson Cristina,Cao Liqiang,Lai Zhonghe,et al.Isothermal low cycle fatigue behavior of Sn-8Zn-3Bi on single shear solder joint [J].Electronic Components and Technology,2005,1(1):696-700.
[5] 吴宇虎.无铅焊料在焊接过程中氧化行为的表征技术研究[D].上海:复旦大学材料系,2000.
[6] 陈壹华.HASL及其应用焊料前景[J].印制电路信息,2004(1):50-53.
Chen Yihua.The anticipate foreground of HASL and its applied solder [J]. Printed Circuit Information,2004(1):50-53.(in Chinese)
[7] 周健,孙扬善,薛烽.低熔点Sn-Zn-Bi无铅焊料的组织和性能[J].金属学报,2005,41(7):743-749.
Zhou Jian,Sun Yangshan,Xue Feng.Microstructures and properties of Sn-Zn-Bi solder alloys[J].Acta Metallurgica Sinica,2005,41(7):743-749.(in Chinese)
[8] 黄惠珍,魏秀琴,周浪.无铅焊料及其可靠性的研究进展 [J].电子元件与材料,2003,22(4):39-42.
Huang Huizhen,Wei Xiuqin,Zhou Lang.Progress in the study on the lead-free solder and its reliability[J]. Electronic Components & Materials,2003,22(4):39-42.(in Chinese)
[9] 黎小燕,陈国海,马莒生.Sn-Zn无铅焊料的研究与发展[J].电子工艺技术,2004,25(4):150-153.
Li Xiaoyan,Chen Guohai,Ma Jusheng.Research and development of Sn-Zn lead-free solder [J]. Electronics Process Technology,2004,25(4):150-153.(in Chinese)
[10] Komiyama T,Chonan Y,Onuki J,et al.The influence of phosphorus concentration of electroless plated Ni-P film on interfacial structures in the joints between Sn-Ag solder and Ni-P alloy film [J].Materials Transactions,2002,2(43):27-31.
[11] Suganuma K.Advances in lead-free electronics soldering [J].Current Opinion Solid State Mater Sci,2001,5(1):55-64.
[12] Mulugeta Abtew,Guna Selvaduray.Lead-free solders in microelectronics [J]. Mater Sci Eng,2000,27(26):95-141.
[13] Pierre V,Alan P,Okamoto H. Handbook of ternary alloy phase diagrams[M].Washington D C:ASM,1995:218-232.
相似文献/References:
[1]周健,王常亮,薛烽.Sn-Zn钎料Cu接头的界面反应及力学性能[J].东南大学学报(自然科学版),2009,39(3):615.[doi:10.3969/j.issn.1001-0505.2009.03.037]
Zhou Jian,Wang Changliang,Xue Feng.Interfacial reaction and joint strength of Sn-Zn solder/Cu[J].Journal of Southeast University (Natural Science Edition),2009,39(5):615.[doi:10.3969/j.issn.1001-0505.2009.03.037]
[2]宋海亮,吕锡武,李先宁,等.水生植物滤床处理太湖入湖河水的工艺性能[J].东南大学学报(自然科学版),2004,34(6):810.[doi:10.3969/j.issn.1001-0505.2004.06.021]
Song Hailiang,Lü Xiwu,Li Xianning,et al.Performance of aquatic plant filter bed for the treatment of Taihu Lake inflow water[J].Journal of Southeast University (Natural Science Edition),2004,34(5):810.[doi:10.3969/j.issn.1001-0505.2004.06.021]
[3]王常亮,周健,孙扬善,等.Sn-8Zn-3Bi无铅钎料的抗氧化性[J].东南大学学报(自然科学版),2008,38(4):693.[doi:10.3969/j.issn.1001-0505.2008.04.029]
Wang Changliang,Zhou Jian,Sun Yangshan,et al.Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys[J].Journal of Southeast University (Natural Science Edition),2008,38(5):693.[doi:10.3969/j.issn.1001-0505.2008.04.029]
[4]张宏保.湖泊中磷负荷管理模型及其应用[J].东南大学学报(自然科学版),1991,21(1):101.[doi:10.3969/j.issn.1001-0505.1991.01.016]
Zhang Hongbao.A Study of Management Model of Phosphorus Loading in Lakes[J].Journal of Southeast University (Natural Science Edition),1991,21(5):101.[doi:10.3969/j.issn.1001-0505.1991.01.016]
[5]殷志平,吴义锋,吕锡武.基于一级动力学模型的水培蔬菜滤床氮磷去除模拟[J].东南大学学报(自然科学版),2016,46(4):812.[doi:10.3969/j.issn.1001-0505.2016.04.023]
Yin Zhiping,Wu Yifeng,Lü Xiwu.Simulation of nitrogen and phosphorus removal in hydroponic vegetable filter bed based on first-order kinetics model[J].Journal of Southeast University (Natural Science Edition),2016,46(5):812.[doi:10.3969/j.issn.1001-0505.2016.04.023]