参考文献/References:
[1] Yi L,Wong C P.Recent advances of conductive adhesives as a lead-free alternative in electronic packaging materials,processing,reliability and applications [J].Materials Science and Engineering R,2006,51(1/2/3):1-35.
[2] Pang J H L,Xiong B S,Low T H.Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder[C] //Proceedings-54th Electronic Components and Technology Conference.Las Vegas,USA,2004,2:1333-133.
[3] Huang Z H,Liu C Q,Conway P,et al.Characterization of intermetallics and mechanical behaviour in the reaction between Sn-Ag-Cu and Sn-Pb solder alloys[C] //Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.Shanghai,China,2004:52-59.
[4] Mulugeta A,Guna S.Lead-free solders in microelectronics [J].Materials Science and Engineering R,2000,27(5/6):95-141.
[5] Amagai M,Toyoda Y,Tajima T.High solder joint reliability with lead free solders[C] //Proceedings-Electronic Components and Technology Conference.New Orleans,USA,2003:317-322.
[6] Stam F A,Davitt E.Effects of thermomechanical cycling on lead and lead-free(SnPb and SnAgCu)surface mount solder joints[J].Microelectronics Reliability,2001,41(11):1815-1822.
[7] Yu S P,Wang H C,Wang Moo Chin,et al.Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate[J]. Journal of Materials Science,2002,37(1):185-190.
[8] Lee J E,Kim K S,Suganuma K,et al.Interfacial properties of Zn-Sn alloys as high temperature lead-free solder on Cu substrate[J].Materials Transactions,2005, 46(11):2413-2418.
[9] Zhou J,Sun Y S,Xue F.Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders[J]. Transactions of Nonferrous Metals Society of China,2005,15(5):1161-1165.
[10] Kim K S,Yu C H,Kim N H,et al.Isothermal aging characteristics of Sn-Pb micro solder bumps[J]. Microelectronics Reliability,2003,43(5):757-763.
[11] Choubey A,Yu H,Osterman M,et al.Intermetallics characterization of lead-free solder joints under isothermal aging[J].Journal of Electronic Materials,2008,37(8):1130-1138.
[12] Onishi M,Kuwayama K,Murata Y,et al.Kirkendall effect and movement of α/β interface due to interdiffusion in Cu-Zn system[J]. Materials Transactions, 1990,31(12):1028-1032.
[13] Lin W H,Chuang T H.Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates [J]. Journal of Materials Engineering and Performance,2003,12(4):452-455.
[14] Lee H T,Chen M H.Influence of intermetallic compounds on the adhesive strength of solder joints [J]. Materials Science and Engineering A,2002, 333(1/2):24-34.
[15] Kim D,Yu Q,Kobayashi Y,et al.Effect of voids on thermal fatigue reliability of lead free solder joint[C] //Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS,NEMS,and Electronic Systems:Advances in Electronic Packaging. San Francisco,USA,2005,C:1643-1648.
相似文献/References:
[1]王常亮,周健,孙扬善,等.Sn-8Zn-3Bi无铅钎料的抗氧化性[J].东南大学学报(自然科学版),2008,38(4):693.[doi:10.3969/j.issn.1001-0505.2008.04.029]
Wang Changliang,Zhou Jian,Sun Yangshan,et al.Investigation on oxidation resistance of Sn-8Zn-3Bi lead-free solder alloys[J].Journal of Southeast University (Natural Science Edition),2008,38(3):693.[doi:10.3969/j.issn.1001-0505.2008.04.029]
[2]付小琴,周健,孙扬善,等.Sn-8Zn-3Bi-P无铅钎料微观组织及性能[J].东南大学学报(自然科学版),2006,36(5):831.[doi:10.3969/j.issn.1001-0505.2006.05.030]
Fu Xiaoqin,Zhou Jian,Sun Yangshan,et al.Effect of phosphorus on microstructure and properties of Sn-8Zn-3Bi lead-free solder[J].Journal of Southeast University (Natural Science Edition),2006,36(3):831.[doi:10.3969/j.issn.1001-0505.2006.05.030]