[1]周健,王常亮,薛烽.Sn-Zn钎料Cu接头的界面反应及力学性能[J].东南大学学报(自然科学版),2009,39(3):615-622.[doi:10.3969/j.issn.1001-0505.2009.03.037]
 Zhou Jian,Wang Changliang,Xue Feng.Interfacial reaction and joint strength of Sn-Zn solder/Cu[J].Journal of Southeast University (Natural Science Edition),2009,39(3):615-622.[doi:10.3969/j.issn.1001-0505.2009.03.037]
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Sn-Zn钎料Cu接头的界面反应及力学性能()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
39
期数:
2009年第3期
页码:
615-622
栏目:
电子科学与工程
出版日期:
2009-05-20

文章信息/Info

Title:
Interfacial reaction and joint strength of Sn-Zn solder/Cu
作者:
周健 王常亮 薛烽
东南大学材料科学与工程学院,南京 211189; 东南大学江苏省先进金属材料高技术研究重点实验室, 南京 211189
Author(s):
Zhou Jian Wang Changliang Xue Feng
School of Material Science and Engineering, Southeast University, Nanjing 211189, China
Jiangsu Key Laboratory of Advanced Metallic Material, Southeast University, Nanjing 211189,China
关键词:
无铅钎料 锡锌合金 扩散 接头 力学性能
Keywords:
lead-free solder Sn-Zn alloy diffusion joint mechanical properties
分类号:
TN604
DOI:
10.3969/j.issn.1001-0505.2009.03.037
摘要:
研究了时效对Sn-Zn-Bi-Nd/Cu接头的界面反应和力学性能的影响.实验结果表明:经过150 ℃下400 h时效,反应扩散层中不仅原有的Cu5Zn8反应层厚度增加,在近Cu一侧还形成了Cu6Sn5反应层.此外,实验发现在Cu5Zn8反应层中易形成微裂纹,且裂纹长度随着时效时间的延长而增加.此时Sn-Zn钎料接头的剪切强度低于Sn-Pb钎料接头的剪切强度,断裂形式为贯穿Cu5Zn8反应层的解理断裂.在80 ℃时效后,Sn-Zn钎料接头的剪切断口位于钎料区,断裂形式为延性断裂,当时效时间达到1 000 h,接头的剪切强度与Sn-Pb钎料接头的剪切强度相当.
Abstract:
Effects of aging on interfacial reaction and joint strength of Sn-Zn-Bi-Nd/Cu were investigated.Results show that after aging at 150 ℃ for 400 h, besides the Cu5Zn8 intermetallic compound(IMC), another IMC(Cu6Sn5)forms in reaction layer along with Cu substrate. Micro-cracks may appear in the growing Cu5Zn8 layer, and the length of the micro-crack increases with the aging time. Shear strength of the solder/Cu joint is obviously decreased because of the cleavage fracture through the Cu5Zn8 layer. The ductile fracture of the joint after aging at 80 ℃ occurs in the bulk solder. After aging at 80 ℃ for 1 000 h, the shear strength of the Sn-Zn solder/Cu joint approaches that of the Sn-Pb solder/Cu joint.

参考文献/References:

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相似文献/References:

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备注/Memo

备注/Memo:
作者简介: 周健(1977—),男,博士,讲师,jethro@seu.edu.cn.
基金项目: 国家教育部博士点基金资助项目(200802861026).
引文格式: 周健,王常亮,薛烽.Sn-Zn钎料Cu接头的界面反应及力学性能[J].东南大学学报:自然科学版,2009,39(3):615-622. [doi:10.3969/j.issn.1001-0505.2009.03.037]
更新日期/Last Update: 2009-05-20