[1]吴晓婧,薛烽,周健,等.Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响[J].东南大学学报(自然科学版),2009,39(3):623-628.[doi:10.3969/j.issn.1001-0505.2009.03.038]
 Wu Xiaojing,Xue Feng,Zhou Jian,et al.Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders[J].Journal of Southeast University (Natural Science Edition),2009,39(3):623-628.[doi:10.3969/j.issn.1001-0505.2009.03.038]
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Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响()
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《东南大学学报(自然科学版)》[ISSN:1001-0505/CN:32-1178/N]

卷:
39
期数:
2009年第3期
页码:
623-628
栏目:
材料科学与工程
出版日期:
2009-05-20

文章信息/Info

Title:
Effect of Cu and Ni on microstructure and properties of Sn-Zn-Al lead-free solders
作者:
吴晓婧1 薛烽1 周健1 黄丹1 丁克俭2
1 东南大学材料科学与工程学院, 南京 211189; 2 晶尔力金属制品厂, 常州 213144
Author(s):
Wu Xiaojing1 Xue Feng1 Zhou Jian1 Huang Dan1 Ding Kejian2
1 School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
2 Jinlier Metal Products Factory,Changzhou 213144, China
关键词:
无铅焊料 Sn-Zn-Al 润湿性 抗氧化性 力学性能
Keywords:
lead-free solder Sn-Zn-Al wettability oxidation resistance mechanical properties
分类号:
TG146.13;TG146.14
DOI:
10.3969/j.issn.1001-0505.2009.03.038
摘要:
为了提高Sn-Zn系无铅焊料的性能,通过微合金化的方法得到了Sn-Zn-Al-Cu,Sn-Zn-Al-Ni四元无铅焊料.首先采用润湿平衡法对合金在铜片上的润湿力和润湿时间进行了测试,然后采用比色分析的方法直观比较了焊料的抗氧化性,最后测试了焊料的力学性能并对其微观组织进行了分析.结果表明:Cu和Ni的加入使得Sn-Zn-Al合金的润湿性有所提高,同时对抗氧化性无明显影响; 微量Cu,Ni的加入使得组织中的粗大针状富Zn相细化和减少,并出现了新的含铜和含镍增强相,在强度提高的同时,塑性略有降低.
Abstract:
In order to improve the performance of Sn-Zn solders, new Sn-Zn solders were prepared by doping small amounts of Cu or Ni into Sn-Zn-Al ternary alloys. A wetting balance method was utilized to measure the wetting force and wetting time of the solders on Cu substrate. By using the colorimetric analysis, the oxidation resistance of the solders was evaluated. Finally the mechanical property was tested and the microstructure was investigated. The results show that the additions of Cu and Ni into Sn-Zn-Al solders improves the wettability while it has no obvious effect on oxidation resistance. Minute additions of copper and nickel cause the decrease in the needle-like primary Zn-rich phase and the appearance of Cu-Zn or Ni-Zn intermetallic compound, which results in increments of tensile strength and a little deterioration of elongation.

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相似文献/References:

[1]薛烽,周健,李培培,等.界面反应及界面张力对Sn-Zn-Bi焊料润湿性的影响[J].东南大学学报(自然科学版),2007,37(4):634.[doi:10.3969/j.issn.1001-0505.2007.04.018]
 Xue Feng,Zhou Jian,Li Peipei,et al.Effect of interface reaction and interface tension on wettability of Sn-Zn-Bi solders[J].Journal of Southeast University (Natural Science Edition),2007,37(3):634.[doi:10.3969/j.issn.1001-0505.2007.04.018]

备注/Memo

备注/Memo:
作者简介: 吴晓婧(1986—),女,硕士生; 薛烽(联系人),男,博士,教授,xuefeng@seu.edu.cn.
基金项目: 国家教育部博士点基金资助项目(200802861026).
引文格式: 吴晓婧,薛烽,周健,等.Cu,Ni对Sn-Zn-Al无铅焊料组织和性能的影响[J].东南大学学报:自然科学版,2009,39(3):623-628. [doi:10.3969/j.issn.1001-0505.2009.03.038]
更新日期/Last Update: 2009-05-20